TrendForce reports that the NAND flash industry suffered a 6% revenue drop in Q4 24 and is expected to plummet by 20% further ...

The 10th Gen V-NAND device that Samsung presented at ISSCC is a 3D TLC NAND device with over 400 active layers, a 1 Tb capacity per die, and a 5.6 GT/s interface speed. As the new ...

Chinese semiconductor companies are actively investing in homegrown tech to mitigate the impact of US sanctions.

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks,1 mechanical ...

following an approach introduced in 3D NAND. The other two categories have more dissimilar characteristics and do not exist in typical logic SoCs. The analog sense amplifier requires good ...

PNY CS900 500GB 3D Internal SSD for $27.99 (list price $ ... delivers zippy performance is a great deal. Using Samsung's V-NAND 3-bit triple-layer-cell flash construction, it doesn't pull a ton ...

Researchers have developed a hydrogen fluoride plasma technique that doubles the etching rate in the manufacturing process of 3D NAND flash memory chips. Standard NAND flash storage is used in ...

South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND. YMTC continues to ...

The company has a new memory architecture called high-bandwidth flash that fuses the massive storage capacity of 3D NAND with the kind of bandwidth offered by HBM. This hybrid creation stacks up a ...

It focuses on 3D NAND flash memory, a critical component in storage devices like SSDs, smartphones, and data centers, and most famously developed Xtacking technology, a proprietary architecture ...

That's the audience for the new Ryzen 9 9950X3D, a 16-core, Zen 5-based, $699 monster of a processor that AMD begins selling ...