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The European Union consortium PREVAIL, created to accelerate the development of next-generation edge-AI technologies, will ...
Department of Electrical and Computer Engineering, Holonyak Micro and Nanotechnology Laboratory, University of Illinois Urbana-Champaign, Urbana, Illinois 61801, United States ...
New platform combines genetic algorithms with freeform geometry to design resilient, high-performance MEMS accelerometers ...
EV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future ...
The experimental confirmation, validation and characterization of fabricated proof of concept MEMS and 3D-printing microthruster and microthrusters arrays with hydroxide nanoenergeticss propellants ...
Abstract: A cost effective and reliable technology allowing extreme miniaturization of batteries into silicon, glass chips and electronic packages has been developed, employing a dispense-print ...
SAN JOSE -- Samsung Electronics Co. will launch three-dimensional (3D) packaging services for high-bandwidth memory (HBM) within the year, a technology expected to be introduced for the artificial ...
Few companies in the world of 3D printing have been able to continue to grow and evolve their technology as Formlabs. Unlike many market leaders in the filament extrusion segment, its products have ...
KLA Corporation, a US company specialising ni semiconductor process control, has announced the opening of its new $138m R&D and manufacturing center in Newport, Wales, UK, continuing the company’s ...
At the same time, however, I see energy harvesting as often being oversold at best and overhyped at worst. There’s a real ...
At the heart of Innovate Together was the launch of the SiC Open R&D Line. Designed to enable joint SiC innovation between ...
STMicroelectronics, a long-standing investor in Singapore’s semiconductor industry, views Lab-in-Fab as a critical asset for its Ang Mo Kio campus. It complements the company’s existing volume ...
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