The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

Today's high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs ...

Taiwan Semiconductor Manufacturing Co on Wednesday unveiled technology for making faster chips and putting them together in ...

As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the ...

TAIPEI (Taiwan News) — TSMC unveiled its next-generation System-on-Wafer-X (SoW-X) technology on Thursday, with mass ...

Applied Materials, Lam Research, and KLA each generated 31.3%, 31%, and 36% of their revenue from China in 2024, according to ...

ChEmpower Corp., a semiconductor materials company providing polish pads and chemical solutions, today announced it has ...

As per Future Market Insights’ updated report, the global wafer testing service market size is set to reach USD 9,823.6 ...

The points of the target shape on the right form a circular inner ring, as shown by the blue tracing. If you draw that exact ...

United Microelectronics Corp (UMC, 聯電) forecast that its wafer shipments this quarter would grow up to 7 percent sequentially ...

South Korea's leading private equity firms are eyeing a controlling stake in semiconductor wafer producer SK Siltron, which ...

A room-temperature infrared sensor sensitive enough for night-vision goggles yet light enough to mount on ordinary spectacles ...