Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates which ...

The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and lower substrate heaters and precise programmable force control during the wafer ...

Hybrid or heterogeneous integration solutions, such as flip-chip, micro-transfer printing or die-to-wafer bonding, involve complex bonding processes or the need for expensive III-V substrates ...

Surfaces must remain clean and smooth for a high-quality bond. Atomflo tm plasma will activate glass wafers without adding particles or increasing roughness. Epoxy protects semiconductors and ...