Wafer bonding has become a fundamental core capacity for any high-volume MEMS production facility that makes anything from accelerometers to silicon sensors for automotive, aerospace and consumer ...

Let us help you with your inquiries, brochures and pricing requirements Request A Quote Download PDF Copy Download Brochure The DXB is used for mounting wafer to ...

Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform ... enabling hermetic sealing and pressure or vacuum encapsulation.

BANGALORE, India, April 11, 2025 /PRNewswire/ -- Hybrid Bonding Technology Market is Segmented by Type (Wafer ... high‑growth mainstream adoption. Capacity announcements, multi‑year equipment ...

The GEMINI equipment platform includes a newly designed high ... based wafer bonding (Eutectic, Transient-Liquid-Phase and Thermo-compression) plays an essential role in the manufacture of these MEMS ...