Wafer bonding has become a fundamental core capacity for any high-volume MEMS production facility that makes anything from accelerometers to silicon sensors for automotive, aerospace and consumer ...
Suitable for all types of wafers and substrates up to 200mm diameter, stack thickness up to 6mm High post-bond alignment accuracy is ensured by the SUSS transport fixture with automated wafer clamping ...
Based on the global industry standard for high-volume-manufacturing (HVM) wafer bonding, the new GEMINI equipment platform ... enabling hermetic sealing and pressure or vacuum encapsulation.
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