A GaN layer epitaxially grown on Si substrate is successfully bonded to a 10-mm by 10-mm diamond plate with no use of intermediate layers. The photo, taken from the transparent diamond side ...
The EV Group (EVG), a provider of process solutions for semiconductor designs and chip integration schemes, has unveiled the next-generation version of its GEMINI automated production wafer bonding ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback