A $450 million bond issue for Wichita Public Schools has officially failed after Sedgwick County Commissioners certified ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

The SB6/8e system features a rigid vacuum chamber for best-in-class post-bond alignment accuracy, independent upper and lower substrate heaters and precise programmable force control during the wafer ...

Samsung, the world's largest memory chipmaker, is reportedly set to lease hybrid bonding patents from Chinese semiconductor firm YMTC to manufacture its next-generation V10 NAND flash storage chips.

Silicon Connect chief executive officer (CEO) Chin Yoong Tatt said the partnership will see the development of a scalable ...