Using lower temperature and no flash point chemicals to achieve comparable deflashing effectiveness without inducing ...

Researchers at Kyoto University have developed a machine learning model integrated with neural networks to predict the band ...

Delamination occurs when there is a mismatch in coefficients of thermal expansion (CTE) between the encapsulate materials, such as the mold compound used to encapsulate the semiconductor chip and the ...

The template acts as a scaffold or mold, providing a confined space for the synthesis ... For better visibility, the silicon is colored in green, and the compound semiconductor in red. (Image: IBM) ...

Epoxy protects semiconductors and helps prevent field failures. Activating lead frames and packages before molding enhances the adhesion of mold compounds resulting in better resistance to ...