At this week's IEEE ECTC 2025 conference, research hub Imec demonstrated an integrated 300 mm RF silicon interposer platform ...

Integrating diamond heat spreaders in fully fabricated transistors offers a heat management solution for high-power radio ...

MmWave (30-100GHz) and sub-THz (100-300GHz) bands are seen as the future for next-generation RF systems including wireless ...

Kuball added that potential road safety improvements from advanced driver assistance systems (ADAS) and industrial automation ...

Similar difficulty also applies to metal-based radio-frequency (RF) components. Issues like poor thickness control, uneven sidewalls, and material limitations have constrained performance and ...