At VLSI Symposium 2025, Intel will provide more details about its 18A process node featuring RibbonFET transistors and ...

"Intel 18A is now ready ... front-side power designs. RibbonFET gate-all-around (GAA) transistor technology, enabling precise ...

Intel’s new 18A manufacturing process is set to change the way processors are built, offering impressive boosts in both ...

It has also unveiled its first new transistor architecture in over a decade, and named it RibbonFET. First up is Intel's new node naming strategy detailed in the roadmap seen above. The company is ...

RibbonFET provides better transistor density along with faster transistor switching in a smaller area. Intel is working to a broader foundry roadmap. There will be a follow-on 14A node which is ...

The node will make use of what Intel called two “breakthrough” technologies, PowerVia and RibbonFET. Intel said PowerVia is a “unique, industry-first implementation of backside power ...

AMD put out a release yesterday, justifiably crowing that one if its EPYC "Venice" processors was the first HPC product to ...

The 18A node is a part of Intel’s aggressive “five nodes in four years” strategy, and introduces advanced manufacturing techniques such as RibbonFET gate-all-around transistors and PowerVia ...

New Intel CEO Lip-Bu Tan has reportedly initiated plans for layoffs exceeding 20% of staff, aiming to cut bureaucracy ahead ...

The 18A node represents a major technological leap for Intel, incorporating innovations such as RibbonFET transistor architecture and PowerVia backside power delivery. These advancements promise ...

including backside power delivery and RibbonFET transistors, that are currently advantages unique to Intel. Together, the two should enable Intel to produce chips that are more performant and more ...