Metal-based wafer bonding (Eutectic, Transient-Liquid-Phase and Thermo-compression) plays an essential role in the manufacture of these MEMS devices by enabling hermetic sealing and pressure or ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

G-ray struck upon a wafer-to-wafer direct covalent bonding approach that opened a broad range of applications covering a wide range of industries. The upshot is that G-ray is now positioned to ...

EV Group unveils new version of its GEMINI automated production wafer bonding system supporting MEMs advancements.