The race is on to implement wafer stacking and die-to-wafer hybrid bonding, now considered essential for stacking logic and memory, 3D NAND, and possibly multi-layer DRAM stac... » read more ...

Used in the production of semiconductors, wafer bonders are devices that allow for a mechanically-stable and sealed packaging of microelectromechanical systems (MEMS), nanoelectromechanical systems ...

G-ray struck upon a wafer-to-wafer direct covalent bonding approach that opened a broad range of applications covering a wide range of industries. The upshot is that G-ray is now positioned to ...